Labari daya fahimta |Menene tushen zaɓin tsarin sarrafa ƙasa a cikin masana'antar PCB

• 1. Iska mai zafi a kwance (fasa tin)

Babban tsari na matakan daidaita iska mai zafi shine: micro yashwar → preheating → shafi walda → fesa tin → tsaftacewa.

Iska mai zafi lebur ce, wadda kuma aka sani da iskar zafi wadda aka yi wa walda (wanda aka fi sani da fesa tin), wanda shine aikin shafa narkewar tin (lead) da aka yi masa walda a saman PCB da yin amfani da dumama don damfara gyaran iska (busa) don samarwa. Layer na anti-copper oxidation.Yana kuma iya samar da kyau weldability shafi yadudduka.Dukkan weld da tagulla na iska mai zafi suna samar da sinadarin jan ƙarfe -tin ƙarfe mai haɗawa a hade.PCB yawanci yana nutsewa a cikin ruwa mai narkewa;wukar iska tana busa ruwan lebur ɗin lebur wanda aka welded kafin walda;

Matsayin iskar thermal ya kasu kashi biyu: a tsaye da a kwance.An yi imani da cewa nau'in kwance ya fi kyau.Shi ne yafi kwance zafi iska gyara Layer ne in mun gwada da uniform, wanda zai iya cimma sarrafa kansa samarwa.

Abũbuwan amfãni: tsawon lokacin ajiya;bayan an gama PCB, saman jan ƙarfen ya jike gaba ɗaya (an rufe kwano gaba ɗaya kafin walda);dace da gubar walda;balagagge tsari, low cost, dace da gani dubawa da lantarki gwajin

Rashin hasara: Bai dace da ɗaurin layi ba;saboda matsalar rashin kwanciyar hankali, akwai kuma iyakance akan SMT;bai dace da ƙirar canjin lamba ba.Lokacin fesa tin, jan ƙarfe zai narke, kuma allon yana da zafi sosai.Musamman faranti mai kauri ko sirara, fesa tin yana da iyaka, kuma aikin samarwa bai dace ba.

• 2, Organic weldability protectant (OSP)

Tsarin gabaɗaya shine: raguwa -> micro-etching -> pickling -> tsaftace ruwa mai tsabta -> shafaffen kwayoyin --> tsaftacewa, kuma sarrafa tsari yana da sauƙi don nuna tsarin jiyya.

OSP wani tsari ne na bugu na allon da'ira (PCB) tagulla mai rufin rufin ƙarfe daidai da buƙatun umarnin RoHS.OSP gajere ne don Ma'ajin Solderability Preservatives, wanda kuma aka sani da abubuwan kiyayewa na halitta, wanda kuma aka sani da Preflux a cikin Ingilishi.A taƙaice, OSP fim ne na fata na halitta wanda aka haɓaka da sinadarai a kan tsaftataccen saman jan karfe.Wannan fim din yana da anti-oxidation, girgiza zafi, juriya na danshi, don kare saman jan karfe a cikin yanayin al'ada ba tsatsa ba (hadawan abu da iskar shaka ko vulcanization, da dai sauransu);Duk da haka, a cikin yanayin zafin walda na gaba, wannan fim ɗin mai kariya dole ne a sauƙaƙe ta hanyar juzu'i da sauri, ta yadda za a iya haɗa saman jan ƙarfe mai tsabta da aka fallasa nan da nan tare da narkakkar solder a cikin ɗan gajeren lokaci don zama haɗin gwiwa mai ƙarfi.

Abũbuwan amfãni: Tsarin yana da sauƙi, saman yana da lebur sosai, ya dace da walƙiya marar gubar da SMT.Sauƙaƙe don sake yin aiki, aikin samarwa mai dacewa, dacewa da aikin layin kwance.Hukumar ta dace da aiki da yawa (misali OSP+ENIG).Low cost, m muhalli.

Disadvantages: iyakance yawan reflow waldi (yawan walda lokacin farin ciki, da fim za a hallaka, m 2 sau ba matsala).Bai dace da fasahar crimp ba, daurin waya.Gano gani da gano wutar lantarki ba su dace ba.Ana buƙatar kariyar gas na N2 don SMT.SMT sake yin aikin bai dace ba.Babban buƙatun ajiya.

• 3, duk farantin da aka yi da zinari na nickel

Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate Plate nickel plating is the PCB surface conductor da aka fara fentin da Layer na nickel sa'an nan kuma aka yi masa da zinari, nickel plating yafi hana yaduwa tsakanin zinari da tagulla.Akwai nau'i biyu na electroplated nickel zinariya: zinariya plating (tsalle zinariya, zinariya surface ba ya haske) da kuma wuya zinariya platin (m da wuya saman, sawa-resistant, dauke da wasu abubuwa kamar cobalt, zinariya surface dubi haske).Ana amfani da gwal mai laushi da yawa don buɗaɗɗen waya na gwal;Ana amfani da gwal mai kauri a haɗin haɗin lantarki marasa walƙiya.

Abvantbuwan amfãni: Tsawon lokacin ajiya> watanni 12.Ya dace da ƙirar canjin lamba da ɗaurin waya na gwal.Dace da gwajin lantarki

Rauni: farashi mafi girma, zinariya mai kauri.Yatsun lantarki suna buƙatar ƙarin ƙirar ƙirar waya.Domin kaurin zinari baya daidaitawa, idan aka yi amfani da shi akan walda, yana iya haifar da ɓarkewar haɗin gwiwar solder saboda kauri mai kauri, yana shafar ƙarfi.Electroplating surface uniformity matsala.Electroplated nickel zinariya ba ya rufe gefen waya.Bai dace da haɗin waya ta aluminum ba.

• 4. Zurfafa zinare

Babban tsari shine: tsaftacewa --> micro-lalacewa --> preleaching -> kunnawa -> plating mara amfani da nickel plating --> leaching zinariya;Akwai tankunan sinadarai guda 6 a cikin aikin, wanda ya ƙunshi kusan nau'ikan sinadarai 100, kuma tsarin ya fi rikitarwa.

An nannade zinare mai kauri a cikin kauri, kayan aikin lantarki mai kyau na nickel zinariya akan saman jan karfe, wanda zai iya kare PCB na dogon lokaci;Bugu da ƙari, yana da juriya ga muhalli wanda sauran hanyoyin jiyya na saman ba su da.Bugu da kari, nitsewar zinari kuma na iya hana rushewar tagulla, wanda zai amfana da hadawa mara gubar.

Abũbuwan amfãni: ba sauki oxidize, za a iya adana na dogon lokaci, da surface ne lebur, dace da waldi lafiya rata fil da aka gyara tare da kananan solder gidajen abinci.PCB da aka fi so tare da maɓalli (kamar allon wayar hannu).Za'a iya maimaita walda ta sake kwarara sau da yawa ba tare da asarar walda da yawa ba.Ana iya amfani da shi azaman kayan tushe don COB (Chip On Board) wayoyi.

Rashin hasara: tsada mai tsada, rashin ƙarfi na walda, saboda amfani da tsarin nickel mara amfani da shi, mai sauƙin samun matsalolin diski na baki.Layer na nickel oxidizes na tsawon lokaci, kuma dogara na dogon lokaci shine batun.

• 5. Zubar ruwa

Tunda duk masu siyar da na yanzu sun dogara ne akan tin, tin Layer na iya dacewa da kowane nau'in solder.Hanyar nutsewar tin na iya haifar da ma'aunin ƙarfe na ƙarfe na ƙarfe na ƙarfe na ƙarfe, wanda ke sa tin ɗin da ke nutsewa yana da kyakkyawar solderability iri ɗaya kamar daidaitawar iska mai zafi ba tare da matsalar flatulence na ciwon kai ba;Ba za a iya adana farantin na dogon lokaci ba, kuma dole ne a gudanar da taron bisa ga umarnin nutsewar tin.

Abũbuwan amfãni: Ya dace da samar da layin kwance.Ya dace da sarrafa layi mai kyau, dace da walƙiya mara gubar, musamman dacewa da fasahar crimping.Kyakkyawan flatness, dace da SMT.

Hasara: Ana buƙatar yanayin ajiya mai kyau, zai fi dacewa bai wuce watanni 6 ba, don sarrafa ci gaban tin whisker.Bai dace da ƙirar canjin lamba ba.A cikin tsarin samarwa, tsarin fim ɗin juriya na walda yana da girma sosai, in ba haka ba zai haifar da juriya na walda ya faɗi.Don waldawa da yawa, kariya ta iskar gas ta N2 ita ce mafi kyau.Auna wutar lantarki ma matsala ce.

• 6. Zubar da azurfa

Tsarin nitsewar Azurfa yana tsakanin suturar kwayoyin halitta da sakan nickel/plating na zinare mara amfani, tsarin yana da sauƙi da sauri;Ko da a lokacin da aka fallasa zuwa zafi, zafi da ƙazanta, azurfa har yanzu tana iya kula da kyakkyawan walƙiya, amma za ta rasa haske.Platin Azurfa ba shi da kyakkyawan ƙarfin jiki na nickel plating/plating na zinari mara amfani saboda babu nickel a ƙarƙashin layin azurfa.

Abũbuwan amfãni: Simple tsari, dace da gubar-free waldi, SMT.Filaye mai faɗi sosai, ƙarancin farashi, dacewa da layukan lafiya sosai.

Hasara: Babban buƙatun ajiya, mai sauƙin ƙazanta.Ƙarfin walda yana da sauƙi ga matsaloli (matsalar micro-cavity).Abu ne mai sauƙi a sami al'amari na ƙaura da kuma yanayin cizon Javani na jan karfe a ƙarƙashin fim ɗin juriya na walda.Auna wutar lantarki ma matsala ce

• 7, sinadarin nickel palladium

Idan aka kwatanta da hazo na zinari, akwai ƙarin nau'in palladium tsakanin nickel da zinariya, kuma palladium na iya hana al'amuran lalata da canjin yanayi ya haifar da yin cikakken shiri don hazo na zinariya.Zinariya an lullube shi da palladium, yana samar da kyakkyawar fuskar sadarwa.

Abũbuwan amfãni: Ya dace da walƙiya mara gubar.Very lebur surface, dace da SMT.Ta hanyar ramuka kuma na iya zama zinariya nickel.Dogon lokacin ajiya, yanayin ajiya ba shi da tsauri.Dace da gwajin lantarki.Dace don canza ƙirar lamba.Ya dace da ɗaurin waya na aluminum, dace da farantin kauri, juriya mai ƙarfi ga harin muhalli.

• 8. Electroplating m zinariya

Domin inganta juriyar lalacewa na samfurin, ƙara yawan shigarwa da cirewa da kuma sanya zinari mai ƙarfi.

Canje-canjen tsarin jiyya na PCB ba su da girma sosai, yana da alama abu ne mai nisa, amma ya kamata a lura cewa canje-canjen jinkiri na dogon lokaci zai haifar da manyan canje-canje.A cikin yanayin ƙara kira don kare muhalli, tsarin jiyya na PCB tabbas zai canza sosai a nan gaba.