Daga tarihin ci gaba na guntu, jagorancin ci gaba na guntu yana da sauri, babban mita, ƙananan amfani. Tsarin kera guntu galibi ya haɗa da ƙirar guntu, masana'antar guntu, masana'anta marufi, gwajin farashi da sauran hanyoyin haɗin gwiwa, waɗanda tsarin kera guntu ya fi rikitarwa. Bari mu dubi tsarin kera guntu, musamman tsarin kera guntu.
Na farko shine ƙirar guntu, bisa ga buƙatun ƙira, “tsarin” da aka samar.
1, albarkatun kasa na guntu wafer
Abun da ke ciki na wafer shine silicon, siliki yana mai ladabi ta yashi ma'adini, wafer shine sinadarin silicon yana tsarkake (99.999%), sannan ana yin siliki mai tsafta zuwa sandar silicon, wanda ya zama kayan ma'adini na ma'adini don kera na'urar haɗaɗɗiyar da'ira. , yanki shine takamaiman buƙatar wafer samar da guntu. Mafi ƙarancin wafer, ƙananan farashin samarwa, amma mafi girman buƙatun tsari.
2.Wafer shafi
Rufin wafer na iya tsayayya da iskar shaka da zafin jiki, kuma abu shine nau'in photoresistance.
3, ci gaban lithography, etching
Tsarin yana amfani da sinadarai masu kula da hasken UV, wanda ke sassauta su. Ana iya samun siffar guntu ta hanyar sarrafa matsayi na shading. Silicon wafers an lullube su da photoresist don su narke a cikin hasken ultraviolet. Anan ne za a iya sanya shading na farko, ta yadda ɓangaren hasken UV ya narke, wanda za'a iya wanke shi da sauran ƙarfi. Don haka sauran shi siffar iri ɗaya ce da inuwa, wanda shine abin da muke so. Wannan yana ba mu silica Layer da muke bukata.
4, Kara kazanta
Ana dasa ions a cikin wafer don samar da daidaitattun na'urori na P da N.
Tsarin yana farawa da wuri da aka fallasa akan wafer silicon kuma an saka shi cikin cakuda ions sinadarai. Tsarin zai canza yadda yankin dopant ke gudanar da wutar lantarki, wanda zai baiwa kowane transistor damar kunnawa, kashewa ko ɗaukar bayanai. Chips masu sauƙi na iya amfani da Layer ɗaya kawai, amma kwakwalwan kwamfuta masu rikitarwa sau da yawa suna da yadudduka da yawa, kuma ana maimaita tsarin akai-akai, tare da yadudduka daban-daban da aka haɗa ta taga bude. Wannan yayi kama da tsarin samarwa na allon PCB Layer. Ƙarin hadaddun kwakwalwan kwamfuta na iya buƙatar nau'ikan siliki da yawa, waɗanda za a iya samun su ta hanyar maimaita lithography da tsarin da ke sama, samar da tsari mai girma uku.
5. Gwajin wafer
Bayan matakai da yawa da ke sama, wafer ya kafa lattice na hatsi. An bincika halayen lantarki na kowace hatsi ta hanyar 'aunawar allura'. Gabaɗaya, adadin hatsi na kowane guntu yana da girma, kuma tsari ne mai sarƙaƙiya don tsara yanayin gwajin fil, wanda ke buƙatar yawan samar da samfura tare da ƙayyadaddun guntu iri ɗaya gwargwadon yiwuwa yayin samarwa. Mafi girman girma, ƙananan farashin dangi, wanda shine ɗayan dalilan da yasa na'urorin guntu na yau da kullun suna da arha.
6. Encapsulation
Bayan an ƙera wafer, ana gyara fil, kuma ana samar da nau'ikan marufi daban-daban bisa ga buƙatu. Wannan shi ne dalilin da ya sa guda guntu core iya samun daban-daban marufi siffofin. Misali: DIP, QFP, PLCC, QFN, da dai sauransu. Wannan an yanke shawarar ne ta hanyar halayen aikace-aikacen masu amfani, yanayin aikace-aikacen, sigar kasuwa da sauran abubuwan da ke kewaye.
7. Gwaji da marufi
Bayan tsarin da ke sama, an kammala masana'antar guntu, wannan matakin shine don gwada guntu, cire samfuran da ba su da lahani, da marufi.
Abin da ke sama shine abin da ke da alaƙa na tsarin kera guntu wanda Ƙirƙiri Ganewar Core ya shirya. Ina fatan zai taimake ku. Kamfaninmu yana da ƙwararrun injiniyoyi da ƙungiyar ƙwararrun masana'antu, yana da daidaitattun dakunan gwaje-gwaje 3, yankin dakin gwaje-gwaje ya fi murabba'in murabba'in 1800, na iya ɗaukar kayan aikin lantarki na tabbatarwa, tantancewar IC na gaskiya ko ƙarya, zaɓin kayan ƙirar samfur, ƙididdigar gazawa, gwajin aikin, masana'anta mai shigowa kayan dubawa da tef da sauran ayyukan gwaji.
Lokacin aikawa: Juni-12-2023
