| Yadudduka | 1-2 Layers |
| Ƙaunar Ƙarshe | 16-134mil (0.4mm-3.4mm) |
| Max. Girma | 500mm * 1200mm |
| Kaurin Copper | 35um, 70um, 1 zuwa 10oZ |
| Min Layin Nisa/Sarari | 4mil (0.1mm) |
| Min Ƙarshen Girman Ramin | 0.95mm |
| Min. Girman Drill | 1.00mm |
| Max. Girman Drill | 6.5mm ku |
| Haƙurin Girman Ramin Ƙarshe | ± 0.050mm |
| Madaidaicin Matsayin Buɗaɗɗiya | ± 0.076mm |
| Min SMT PAD Girman | 0.4mm ± 0.1mm |
| Min. Solder Mask PAD | 0.05mm (mil) |
| Murfin Mashin Min. Solder | 0.05mm (mil) |
| Solder mask Kauri | >12 ku |
| Ƙarshen Sama | HAL, HAL Gubar kyauta, OSP, Zinare Immersion, da sauransu |
| HAL Kauri | 5-12 ku |
| Zurfafa Kauri na Zinare | 1-3 mil |
| Kaurin Fim na OSP | ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
| Ƙirar Ƙarshe | Gudanarwa & Punching; Matsakaici Madaidaici ± 0.10mm |
| Thermal Conductivity | 1.0 zuwa 12w/mk |
| FOB Port | Shenzhen |
| Fitar da Ma'aunin Karton L/W/H | 36 x 26 x 25 santimita |
| Lokacin Jagora | 3-7 kwanaki |
| Raka'a a kowace Katin Fitar da shi | 5.0 |
| Fitar da Nauyin Karton | 18 Kilogram |